A Guide to Lead-free Solders
Physical Metallurgy and Reliability

The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.

While tin/lead solders have dominated the electronics industry for many years, environmental considerations and new legislation are forcing change. Backed by more than ten years of research in Pb-free solders, many electronics manufacturers are poised for conversion.

A Guide to Lead-free Solders is intended as a tool to help industry as it moves into a new era in the production and use of solders. An overview of the principles of soldering technology is provided beginning with the theory underlying each concept. Focusing on the most up-to-date methods for testing and characterization, these theories are then reinforced by experimental examples and industrial applications.

• Addresses key issues in assembly from a materials point of view.

• Gives the reader convenient access to data essential for the proper evaluation and employment of cutting-edge ternary Sn/Ag/X solders

• Allows comparison of the performance of Pb-free solders with that of standard eutectic SnPb.

Although primarily of interest to professional design and reliability engineers working in electronics assembly and manufacturing, A Guide to Lead-free Solders will also be valuable for graduate students looking to apply expertise in materials, mechanical or electronic engineering in this industry. Researchers in electronics and materials will find the latest research at their fingertips together with the likely directions industry will need from such research in the future.

Introduction to Solder Alloys and Their Properties.- Packaging Architecture and Assembly Technology.- Wetting And Joint Formation.- Microstructural Instability in Solders.- Intermetallic Formation and Growth.- Mechanical Properties and Creep Behaviour.- Thermomechanical Fatigue.- Product Assurance.